2005-04-20 17:16[Æß] ¼¼°è ¹ÝµµÃ¼Àç·á½ÃÀå µ¿Çâ | ÅõÀÚ¾ÆÀ̵ð¾î
- ¼¼°è ¹ÝµµÃ¼Àç·á½ÃÀå µ¿Çâ
(´ÜÀ§: ¹é¸¸ºÒ)
±¸ ºÐ |
2001 |
2002 |
2003 |
2004(F) |
2005(F) |
Àü °ø Á¤ |
Silicon Wafers |
5,278 |
5,788 |
6,462 |
7,248 |
7,536 |
Other Substes |
415 |
440 |
510 |
600 |
720 |
Photomasks |
2,193 |
2,129 |
2,341 |
2,770 |
3,140 |
Photoresists |
636 |
683 |
748 |
845 |
881 |
Photoresist Ancillaries |
613 |
651 |
722 |
801 |
812 |
Wet Chemicals |
605 |
633 |
676 |
727 |
738 |
Gases |
1,808 |
1,825 |
2,016 |
2,182 |
2,317 |
Sputter Targer |
345 |
369 |
398 |
410 |
418 |
CMP Slurry & Pads |
358 |
428 |
529 |
611 |
648 |
Other New Materials |
160 |
196 |
315 |
440 |
510 |
¼Ò °è |
12,411 |
13,142 |
14,717 |
16,634 |
17,720 |
ÈÄ °ø Á¤ |
Leadframes |
2,602 |
2,864 |
3,100 |
3,224 |
3,282 |
Plastic Laminate Substrates |
1,436 |
1,616 |
1,817 |
2,221 |
2,500 |
Flex Substrates |
265 |
270 |
375 |
410 |
470 |
Ceramic Pkgs. |
1,400 |
1,275 |
1,316 |
1,408 |
1,495 |
Encapsulation Resin |
1,264 |
1,407 |
1,545 |
1,653 |
1,730 |
Bonding Wire |
728 |
885 |
1,110 |
1,220 |
1,294 |
Die Attach Materials |
86 |
97 |
110 |
121 |
126 |
¼Ò °è |
7,781 |
8,414 |
9,373 |
10,257 |
10,897 |
ÇÕ °è |
20,192 |
21,556 |
24,092 |
26,891 |
28,617 |
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